Test Production Equipment

Tester

Brand
Model
Targeted Applications

Credence

ASL 1000

Diode, Comparator, Converter, Power Management Devices, Current Monitor, Class A/AB Audio AMP, etc.

Teradyne
ETS-200T
FETs, Power FETs, etc.
Teradyne
ETS- 300 ; ETS-364
Power Management Device, Display Driver, Consumer Audio, Temperature Sensor, ADSL, Disk Driver, Automotive Device, etc.
Chroma
3360P
Power Management Device, LED Driver, Smart Card, Consumer IC, MCU, etc.
Amida
AMIDA-1000 ; AMIDA-3000
Power Management Devices, Comparator, LED Driver, MOSFET, Motor Driver, MCU, etc.

Handler

Brand Model Type

High Temp.

Available Kit

Hypersonic
KNIGHTS II ; KNIGHTS IV
Gravity NA
SOP/SSOP-150; TSSOP-173; SOP-236;  SOP-300
Semijess
JS-400; JP-400; JS-600; JP-600
Gravity

NA

SOP/SSOP-150; SSOP-209; SOP-236;  DIP-300
Multitest
8704
Gravity

Max. 120℃

SOP/SSOP-150; TSSOP-173; SSOP-209; SOP-236; TSSOP-240; SOP-300
Chip Right
CRH400D
Gravity

NA

DIP-300
Ismeca
NX16
Bowel Feeder

NA

QFN/DFN 1.6*1.6 / 2*2 / 3*3 / 4*4 / 5*5 / 6*6 / 7*7 ; SOT236
SRM
D248 ; XD16 ; XD208 ; XD248
Bowel Feeder

NA

QFN/DFN 1.6*1.6 / 2*2 / 2*3 / 3*3 / 3*4 / 3.5*3.5 / 3.5*4.5 / 4*4 / 5*5 / 5*6 / 5.2*6.2 / 6*6 / 7*7
Chip Right
CRH3400
Pick & Place

Max. 130℃

QFN 3*3 / 4*4 / 5*5 / 7*7; LQFP 9*9 / 10*10 / 14*14/

Prober

Brand Model Wafer Size Wafer Thickness High Temp. Low Temp.
TSK UF200 ; UF200A 4" , 5" , 6" , 8" >= 6 mil Max. 150℃ Min. -40℃

Laser Trimmer

Brand Model Wafer Site Wafer Thickness
ESI ESI9300 ; ESI9350 6" , 8" >= 8 mil

Automated Defect Inspection System

Brand Model Wafer Size Wafer Thickness Min. Defect Size
RUDOLPH AUGUST NSX-90 6" , 8" >= 8 mil 5um